Sodium hypophosphite ( electroless nickel plating)

1. reductant for electroless nickel plating
2. We are manufacturer with two plants
3. ISO9001, ISO14001 ans SGS certificated

Full Name:  Sodium Hypophosphite 

Abbreviation: SHPP / HYPO

Structural  Formula:  NaH2PO2.H2O

CAS Number:  #10039-56-2 

Quality and Characteristic:

White crystal with no clumps, be able to absorb moisture and be soluted in water. It is exploded if mixed with oxidant over 200°C (degree centigrade). It will suddenly separate out hydrogen phosphorus. Molecular weight is 105.99

Specification:  

NaH2PO2.H2O	102-103%
Na2HPO3	0.3%  MAX
Ca	10ppm MAX
SO4	100ppm MAX
Fe	1ppm MAX
Cl	30ppm MAX
PH	6-8
Pb	1ppm MAX

Usage:     Sodium Hypophosphite is often applied as reductant in electroless deposition of nickel (Nickel Chloride, buffers.) It builds complexes with the nickel in the bath, improving the fineness of the surface after treatment.

Storage:     Store in a cool, well-ventilated area. Keep away from ignition sources, heat and flame. Store in tightly closed container. Incompatibilities: oxidants and food